UM again shines at ‘Chip Olympics’

A team of faculty members and students from the University of Macau’s (UM) State-Key Laboratory of Analog and Mixed-Signal VLSI (AMS-VLSI Lab) presented their research findings at the 64^th IEEE (Institute of Electrical and Electronics Engineers) International Solid-State Circuits Conference (ISSCC) held in San Francisco, the United States. Six papers from UM were accepted at this year’s conference, making the university one of the top institutions with the most papers presented at the 64^th ISSCC. This shows international recognition of UM’s leading position in the field in Asia.

A total of 208 papers were accepted at this year’s conference. Among them 11 are from the Greater China region, with 6 from UM, 4 from the Hong Kong University of Science and Technology, and 1 from Analog Devices Inc. The papers deal with five broad subjects, namely wireless communication, RF circuits, digital structure and system, data transformation, and analogue circuits.

Lei Kameng, a doctor of microelectronics and Macao Fellow at UM, received the Pre-doctoral Achievement Award from the IEEE Solid-State Circuits Society at the conference, in recognition of his outstanding research in the field. Two other PhD students from the lab were invited to make presentations in the Student Research Previews section

UM professors U Seng-Pan and Mak Pui-In, deputy director and associate director (research) of the lab, have been invited to serve as members of the Technical Programme Committee of the ISSCC, which has four members from mainland China, Hong Kong and Macao. The other two members are from the Hong Kong University of Science and Technology, and Fudan University, respectively. In addition, Prof U is currently the China Representative of the ISSCC Technical Programme Committee, responsible for the coordination of ISSCC activities in China.

Organised by the IEEE Solid-State Circuits Society and internationally recognised as the Chip Olympics, the ISSCC is the most prestigious international conference in the field of semiconductor integrated circuits, with a rigorous paper selection process. It is also the world’s largest and highest-level conference on solid-state circuits, representing the latest trends in global solid-state circuit research and development. This year’s conference attracted more than 3,000 chip designers from around the world.